IC Chip Encapsulation Research



Nanoflow conducts researches in IC-chip encapsulation field together with Cornell Injection Molding Program :

(1) Research Topics
(2) Publications
(3) Patent Pending

1. Research Topics

Nanoflow conducts the following research topics:

• Wire sweep analysis.
• Paddle-shift analysis
• Flow simulation.
• Material properties characterization.
• Package warpage analysis.
• Process optimization.

2. Publications

• [1] Sejin Han and K. K. Wang, "Filling and Post-filling Analysis in the Encapsulation of Semiconductor Chips", Transactions of ASME, Journal of Electronic Packaging, accepted for publication, 1998.
• [2] Sejin Han, K. K. Wang and D. L. Crouthamel, "Analysis of Wire Sweep During Encapsulation of Semiconductor Chips with Epoxy Molding Compound", Transactions of ASME, Journal of Electronic Packaging, 119, September 1997.
• [3] Sejin Han, K. K. Wang, C. A. Hieber and C. Cohen, "Characterization of the Rheological Properties of a Fast-Curing Epoxy-Molding Compound", Journal of Rheology, 41, 177-195, Mar. 1997.
• [4] Sejin Han and K. K. Wang, "A Study on the Effects of Fillers on Wire Sweep Related to Semiconductor Chip Encapsulation", Transactions of IEEE CPMT Pt. B, 18, 744-750, Nov. 1995.
• [5] Sejin Han and K. K. Wang, "Analysis of Wire Sweep Related to Encapsulation of Semiconductor Chips Using Simulated Experiments", Transactions of ASME, Journal of Electronic Packaging, 117, 178-184, Sept., 1995.
• [6] Sejin Han and K. K. Wang, "Integrated filling and post-filling analysis in semiconductor chip encapsulation", Transactions of ASME, Journal of Electronic Packaging, in review.
• [7] Y. J. Huh, Sejin Han and K. K. Wang, "A Knowledge-Based Synthesis System for Chip Encapsulation", SPE ANTEC Paper, May 1995, Boston, MA.
• [8] Sejin Han and K. K. Wang, "Flow Analysis in a Cavity with Leadframe during Semiconductor Chip Encapsulation", Advances in Electronic Packaging, 1995.
• [9] Sejin Han and K. K. Wang, "Reduction of Wire Sweep during Chip Encapsulation by Runner Balancing and Ram Control", ASME Winter Annual Conference, 1994, Chicago, IL.
• [10] Sejin Han, K. K. Wang, "Viscosity Characterization of Fast Curing Epoxy Molding Compound Using a Transfer Molding Machine", May 1994, SPE ANTEC Paper, San Fransisco, CA.
• [11] Sejin Han and K. K. Wang, "A Study On The Effects Of Fillers On Wire Sweep Related To Semiconductor Chip Encapsulation", ASME Winter Annual Meeting, Nov. 1993, New Orleans, LA.
• [12] Sejin Han and K. K. Wang, "Analysis of Wire Sweep Related to Encapsulation of Semiconductor Chips", SPE ANTEC Paper, May 1993, New Orleans, Louisiana.

3. Patent Pending

• [1] K. K. Wang and Sejin Han, "A Disc/Slit Rheometer for the Characterization of Rheology of Fast-Curing Thermosetting Polymers", Filed for U. S. Patent, 1998.