Nanoflow conducts researches in flip-chip encapsulation field together with Cornell Injection Molding Program:
(1) Research Topics
(2) Publications
(3) Patent Pending
| 1. Research Topics |
 |
Nanoflow conducts the following research topics:
- Development of pressurized underfill encapsulation.
- Development of machine for automatic pressurized encapsulation of flip chips.
- Flow simulation (for pressurized or dispensing case).
- Material properties characterization (viscosity, curing kinetics and surface tension).
| 2. Publications |
|
- [1] Sejin Han and K. K. Wang, "Study on the Pressurized Underfill
Encapsulation of Flip Chips", IEEE CPMT Pt. B, 20, 434-442, November, 1997.
- [2] Sejin Han and K. K. Wang, "Analysis of the Flow of Encapsulant During Underfill Encapsulation of Flip-chips", IEEE CPMT Pt. B, 20, 424-433, November 1997.
- [3] Sejin Han, K. K. Wang and C. H. Cheng, "Study on the Filling Behavior of Encapsulants for Pressurized Underfill Encapsulation of Flip Chips", Advances in Electronic Packaging, June, 1997.
- [4] Sejin Han, K. K. Wang and S. Cho, "Experimental and Analytical Study on the Flow of Encapsulant During Underfill Encapsulation of Flip-Chips", IEEE Electronic Component Technology Conference, May 1996, Orlando, FL.
| 3. Patents |
|
- [1] K. K. Wang and Sejin Han, "Methods for Pressurized Underfill Encapsulation of Integrated Circuits", U. S. Patent, 1998.
- [2] K. K. Wang and Sejin Han, "Apparatuses for Pressurized Underfill Encapsulation of Integrated Circuits", Filed for U. S. Patent, 1997.
